Citation
H. Ohsaki et al., High rate sputter deposition of TiO2 from TiO2-x target, THIN SOL FI, 351(1-2), 1999, pp. 57-60
Citations number
10
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
THIN SOLID FILMS
ISSN journal
00406090
→ ACNP
Volume
351
Issue
1-2
Year of publication
1999
Pages
57 - 60
Database
ISI
SICI code
0040-6090(19990830)351:1-2<57:HRSDOT>2.0.ZU;2-5
Abstract
A new sputter technique for high rate deposition of TiO2 was developed for
applying to common planar magnetron sputter system. With this technique, us
ing plasma sprayed TiO2-x targets and a sputter gas of a few percent of O-2
diluted with Ar, TiO2 films are deposited with a high deposition rate effi
ciency (deposition rate per applied power density) being almost eight times
larger than that of the conventional sputter method using Ti target and O-
2 sputter gas. (C) 1999 Elsevier Science S.A. All rights reserved.