New low emissivity coating based on TwinMag (R) sputtered TiO2 and Si3N4 layers

Citation
J. Szczyrbowski et al., New low emissivity coating based on TwinMag (R) sputtered TiO2 and Si3N4 layers, THIN SOL FI, 351(1-2), 1999, pp. 254-259
Citations number
9
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
THIN SOLID FILMS
ISSN journal
00406090 → ACNP
Volume
351
Issue
1-2
Year of publication
1999
Pages
254 - 259
Database
ISI
SICI code
0040-6090(19990830)351:1-2<254:NLECBO>2.0.ZU;2-C
Abstract
This paper presents the results of the recently developed silver based low emissivity coating on glass with sputtered TiO2 and Si3N4 layers using Twin MagTM. TwinMag technology can strongly influence thin film properties: (i) the substrate is continuously bombarded by positively charged high energeti c ions, (ii) TwinMag technology allows the deposition of TiO2 films in the metallic mode of the cathode characteristic, leading to stable sputtering p rocesses and the high deposition rates. This is of particular interest for large scale industrial applications. The new layer system comprises: Glass \ TiO2 \ Blocker \ Ag \ Blocker \ Si3N4 Titanium dioxide (TiO2) has a high index of refraction, which makes it an excellent material for low-E glass w ith high optical transmission. Furthermore, the TiO2 layers produced by the TwinMag process have very smooth surfaces. This improves the electrical co nductivity of the silver film, thus gives more freedom when designing the o ptical properties of the final product. The top layer, Si3N4, is very hard which secures the excellent mechanical durability of the complete coating. Both the calculated results and experimental measurements show that the opt ical properties of the developed system are very stable, especially the col our appearance, i.e, a relative large change of the thickness of the first or last layer does not shift the colour co-ordinates of the produced coatin g notably. This property is of extraordinary interest in the industrial sca le mass production. (C) 1999 Elsevier Science S.A. All rights reserved.