Titanium dioxide has been deposited on silicon for use as a high-permittivi
ty gate insulator in an effort to produce low-leakage films with oxide equi
valent thicknesses below 2.0 nm. Excellent electrical characteristics can b
e achieved, but TEM and electrical measurements have shown the presence of
a low-resistivity interfacial layer that we take to be SiO2. The leakage cu
rrent follows several mechanisms depending on the bias voltage, Reasonably
good agreement has been seen between current-voltage measurements and a 1D
quantum transport model.