Enhanced low-temperature corner current-carrying inherent to shallow trench isolation (STI)

Citation
Gf. Niu et al., Enhanced low-temperature corner current-carrying inherent to shallow trench isolation (STI), IEEE ELEC D, 20(10), 1999, pp. 520-522
Citations number
12
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
IEEE ELECTRON DEVICE LETTERS
ISSN journal
07413106 → ACNP
Volume
20
Issue
10
Year of publication
1999
Pages
520 - 522
Database
ISI
SICI code
0741-3106(199910)20:10<520:ELCCIT>2.0.ZU;2-K
Abstract
The subthreshold hump in the current-voltage (I-V) characteristics caused b y the current-carrying corner in shallow-trench-isolated (STI) n-channel MO SFET's is significantly enhanced at reduced temperatures, Numerical simulat ions show that the sensitivity of the corner channel's threshold voltage to temperature is smaller than that of the center channel's threshold voltage . This, together with the reduced subthreshold swing at low temperatures, c ontribute to an enhanced subthreshold hump, and is potentially important fo r emerging cryogenic applications.