One of the most effective approaches for a cost reduction of crystalline si
licon solar cells is the better utilization of the crystals by cutting thin
ner wafers. However, such thin silicon wafers must have sufficient mechanic
al strength to maintain a high mechanical yield in cell and module manufact
uring.
The electrical performance of thin cells drops strongly with decreasing cel
l thickness if solar cell manufacturing technologies without a backside pas
sivation or a back-surface-held (BSF) are applied. However, with the applic
ation of a BSF, stable efficiencies of over 17%, even with decreasing cell
thickness, have been reached. Thin solar cells show lower photodegradation,
as is normally observed for Cz-silicon cells with today's standard thickne
ss (about 300 mu m) because of a higher ratio of the diffusion length compa
red to the cell thickness. Cells of about 100-150 mu m thickness fabricated
with the production Cz-silicon show almost no photodegradation.
Furthermore, thin boron BSF cells have a pronounced efficiency response und
er backside illumination. The backside efficiency increases with decreasing
cell thickness and reaches 60% of the frontside cell efficiency for 150 mu
m solar cells and also for solar modules assembled of 36 cells of a thickn
ess of 150 mu m. Assuming, for example, a rearside illumination of 150 W/m(
2), this results in an increased module power output of about 10% relativel
y.