Jg. Tang et al., Micromorphological structure and its forming mechanisms of polyacrylonitrile-based copper gradient composite film, J APPL POLY, 74(8), 1999, pp. 1927-1932
In this article, the micromorphological structure of polyacrylonitrile-copp
er gradient composite film obtained from the electrochemical reduction of a
swelling cathode film was investigated with a scanning electronic microsco
pe and a transmittance electronic microscope. It was found that the micromo
rphological structure in deposited phase is constructed with copper particl
es and sheaves of polyacrylonitrile chains. The diameters of both the coppe
r particles and the sheaves of macromolecules are about 50 nm. Thus the ide
a of the interpenetration between polymeric matrix and deposited metal is s
uggested. Under the enhanced power voltage and the reactor temperature, the
maximums of current in the loop of reaction system shift to lower electroc
hemical reaction time. That means the higher value of them makes the higher
activity in the two aspects of ion move and ion reduction in swelling cath
ode film. The dissolving experiment of gradient composite film showed that
it does not dissolve in N,N-dimethylformamide, and this further confirmed t
he interpenetration between the polymer matrix and the deposited copper. (C
) 1999 John Wiley & Sons, Inc.