Effect of temperature and strain rate on mechanical properties of 63Sn/37Pb solder alloy

Citation
Xw. Shi et al., Effect of temperature and strain rate on mechanical properties of 63Sn/37Pb solder alloy, J ELEC PACK, 121(3), 1999, pp. 179-185
Citations number
14
Categorie Soggetti
Mechanical Engineering
Journal title
JOURNAL OF ELECTRONIC PACKAGING
ISSN journal
10437398 → ACNP
Volume
121
Issue
3
Year of publication
1999
Pages
179 - 185
Database
ISI
SICI code
1043-7398(199909)121:3<179:EOTASR>2.0.ZU;2-H
Abstract
I, this study, tensile tests of 63Sn/37Pb solder were carried our at variou s strain rates from 10(-5) s(-1) to 10(-1) s(-1) over a wide temperature ra nge from -40 degrees C to 125 degrees C to study the effect of strain rate and testing temperature on the mechanical properties in a systematic manner . Based an these experimental data, a set of empirical formulae was derived by a statistical method to describe the effect of temperature and strain r ate in a quantitative manner and explain the variation in the mechanical pr operties published in other reports. It is concluded that the empirical for mulae can be used to characterize the mechanical properties of 63Sn/37Pb ov er a wide range of temperatures and strain rates.