Cylindrical DC magnetron sputtering assisted by microwave plasma

A new magnetron sputtering apparatus assisted by microwave plasma has been developed to achieve high sputter deposition rates at low gas pressures. In this apparatus, a microwave plasma is produced in a cylindrical multipolar magnetron arrangement. and utilized for DC magnetron sputtering deposition . With the assistance of microwave plasma, operation of the magnetron disch arge has been achieved at pressures on the order of 10(-4) Torr. Aluminum f ilms are deposited in this apparatus at rates greater than 50 nm/min even a t the low gas pressure of 2.5 x 10(-4) Torr.