FLIP-chip and "backside" techniques

State-of-the-art techniques for failure localization and design modificatio n through bulk silicon are essential for multi-level metallization and new, flip chip packaging methods. The tutorial reviews the transmission of ligh t through silicon, sample preparation, and backside defect localization tec hniques that are both currently available and under development. The techni ques covered include emission microscopy, scanning laser microscope based t echniques (electrooptic techniques, LIVA and its derivatives), and other no n-IR based tools (FIB, e-beam techniques, etc.). (C) 1999 Elsevier Science Ltd. All rights reserved.