A universal reliability prediction model for SMD integrated circuits basedon field failures

This paper makes a review of integrated circuit field failures on three typ es of environment respectively, Ground Benign (G(B)), Ground Fixed (G(F)), and Airborne Inhabited Cargo (A(IC)). It appears that for permanent working G(B), there was no package related failures and 2/3 of the failures had EO S origin. For G(F) and A(IC) most of the failures were open balls bonds and open solder joints. A universal predicting reliability model is therefore proposed for the die part and for the package part. This study has been car ried out in the frame of a working group, to update the French standard UTE C 80810 (ex RDF93 from CNET), and is an alternative guide to the obsolete M IL-HDBK-217F for predicting reliability calculations. (C) 1999 Elsevier Sci ence Ltd. All rights reserved.