Temperature acceleration of breakdown and quasi-breakdown phenomena in ultra-thin oxides

Citation
S. Bruyere et al., Temperature acceleration of breakdown and quasi-breakdown phenomena in ultra-thin oxides, MICROEL REL, 39(6-7), 1999, pp. 815-820
Citations number
14
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
MICROELECTRONICS RELIABILITY
ISSN journal
00262714 → ACNP
Volume
39
Issue
6-7
Year of publication
1999
Pages
815 - 820
Database
ISI
SICI code
0026-2714(199906/07)39:6-7<815:TAOBAQ>2.0.ZU;2-U
Abstract
A study of the electric field and temperature dependence of the breakdown a nd quasi-breakdown phenomena is presented for 3.5 nm ultra-thin SiO2 gate o xides. Using methodology based on the competing mecanism concept between br eakdown and quasi-breakdown processes, quasi-breakdown activation energy as well as acceleration factor are determined. It is demonstrated on these 3. 5nm gate oxides that the quasi-breakdown temperature activation energy is a lmost temperature independent on the contrary to the breakdown one. Moreove r, it has been shown that the temperature dependence of the breakdown accel eration factor and the electric field dependence of the temperature activat ion energy cannot be explained by a pure "E" and "1/E" models, but can be i nterpreted by the "E" model if at least two types of molecular defect state s are considered. (C) 1999 Elsevier Science Ltd. All rights reserved.