Leakage current variation during two different modes of electrical stressing in undoped hydrogenated n-channel polysilicon thin film transistors (TFTs)

Citation
Fv. Farmakis et al., Leakage current variation during two different modes of electrical stressing in undoped hydrogenated n-channel polysilicon thin film transistors (TFTs), MICROEL REL, 39(6-7), 1999, pp. 885-889
Citations number
11
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
MICROELECTRONICS RELIABILITY
ISSN journal
00262714 → ACNP
Volume
39
Issue
6-7
Year of publication
1999
Pages
885 - 889
Database
ISI
SICI code
0026-2714(199906/07)39:6-7<885:LCVDTD>2.0.ZU;2-I
Abstract
Leakage current evolution during two different modes of electrical stressin g in hydrogenated-undoped n-channel polysilicon thin film transistors (TFTs ) is studied in this work. On-state bias stress (high drain bias and positi ve gate bias) and off-state bias stress (high drain bias and negative gate bias) were performed in order to study the degradation of the leakage curre nt. It is found that during off-state bias stress the gate oxide is more se verely damaged than the SiO2-polySi interface. In contrast, during on-state bias stress, two different degradation mechanisms were detected which are analyzed. (C) 1999 Elsevier Science Ltd. All rights reserved.