Laser interferometric method for ns-time scale thermal mapping of Smart Power ESD protection devices during ESD stress

Citation
C. Furbock et al., Laser interferometric method for ns-time scale thermal mapping of Smart Power ESD protection devices during ESD stress, MICROEL REL, 39(6-7), 1999, pp. 925-930
Citations number
14
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
MICROELECTRONICS RELIABILITY
ISSN journal
00262714 → ACNP
Volume
39
Issue
6-7
Year of publication
1999
Pages
925 - 930
Database
ISI
SICI code
0026-2714(199906/07)39:6-7<925:LIMFNS>2.0.ZU;2-I
Abstract
A backside heterodyne interferometric technique is presented to study therm al effects in smart-power electrostatic discharge (ESD) protection devices during the ESD stress. The temperature increase in the device active area c auses an increase in the silicon refractive index (thermo-optical effect) w hich is monitored by the time-resolved measurements of optical phase change s. Thermal dynamics and spatial temperature distribution in different types of npn transistor structures biased in the avalanche multiplication or sna pback regime are studied with nanosecond time and micrometer spatial resolu tion. The activity and inactivity of the bipolar transistor action is indic ated by the dominant signal arising from the emitter or base region, respec tively. Hot spots have been found at the edges of the structures and attrib uted to the current crowding effect in the emitter. (C) 1999 Elsevier Scien ce Ltd. All rights reserved.