Sub-surface analyses of defects in integrated devices by scanning probe acoustic microscopy

Acoustical analyses of integrated devices have been performed at the nanome ter level by the detection of acoustical waves locally generated by a modul ation of the load force of a scanning probe microscope tip onto a device. M onitoring the acoustical signal measured at the reverse side of the device under test allows us to localize sub-surface defects due to the correspondi ng signal change with approximately 150 nm spatial resolution. (C) 1999 Els evier Science Ltd. All rights reserved.