Optical method for the measurement of the thermomechanical behaviour of electronic devices

Citation
S. Dilhaire et al., Optical method for the measurement of the thermomechanical behaviour of electronic devices, MICROEL REL, 39(6-7), 1999, pp. 981-985
Citations number
3
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
MICROELECTRONICS RELIABILITY
ISSN journal
00262714 → ACNP
Volume
39
Issue
6-7
Year of publication
1999
Pages
981 - 985
Database
ISI
SICI code
0026-2714(199906/07)39:6-7<981:OMFTMO>2.0.ZU;2-4
Abstract
We present in this paper a laser probing method for the study of the surfac e deformation and thermomechanical behaviour of electronic components. The method has been applied to running power devices and creep analysis of sold er joints in after-fabrication processes. The set-up allows following the w hole surface deformation as a function of time even in the long-term range. The method is based upon electronic speckle pattern interferometry (ESPI) and allows measuring surface normal deformation with a 10 nm resolution. (C ) 1999 Elsevier Science Ltd. All rights reserved.