Enhancing IC repairs by combining laser direct-writing of Cu and FIB techniques

The aim of this work was to demonstrate the combination of laser direct-wri ting of Cu and FIB techniques. Preliminary electrical resistivity measureme nts and a comparison between the pros and cons of both methods have been ca rried out. Some IC repair cases are presented where an FIB device has been used in combination with the laser deposition device developed in the micro electronics laboratory. Also, particular attention has been given to proble ms which are insoluble by the FIB technique but readily resolved by the las er system. (C) 1999 Elsevier Science Ltd. All rights reserved.