Lifetime extrapolation for IGBT modules under realistic operation conditions

Authors
Ciappa, M Malberti, P Fichtner, W Cova, P Cattani, L Fantini, F
Citation
M. Ciappa et al., Lifetime extrapolation for IGBT modules under realistic operation conditions, MICROEL REL, 39(6-7), 1999, pp. 1131-1136
Citations number
7
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
MICROELECTRONICS RELIABILITY
ISSN journal
00262714 → ACNP
Volume
39
Issue
6-7
Year of publication
1999
Pages
1131 - 1136
Database
ISI
SICI code
0026-2714(199906/07)39:6-7<1131:LEFIMU>2.0.ZU;2-G
Abstract
In this paper a systematic approach is presented for extrapolating the life time due to bond wire lift-off in IGBT modules submitted to cyclic loading, Application profiles of the device are considered, as they are usually enc ountered in real current converters for railway traction systems. The propo sed lifetime prediction scheme is based on the principle of the linear accu mulation of the fatigue damage and takes into account the redundancy of the bond wires. (C) 1999 Elsevier Science Ltd. All rights reserved.