Anomalies of deformation behavior and microstructure in CuAu ordered alloy

Citation
Ba. Greenberg et al., Anomalies of deformation behavior and microstructure in CuAu ordered alloy, INTERMETALL, 7(11), 1999, pp. 1219-1225
Citations number
12
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
INTERMETALLICS
ISSN journal
09669795 → ACNP
Volume
7
Issue
11
Year of publication
1999
Pages
1219 - 1225
Database
ISI
SICI code
0966-9795(199911)7:11<1219:AODBAM>2.0.ZU;2-R
Abstract
A polycrystal of the ordered CuAu alloy, which had relatively coarse grains (5 to 10 mu m), without the lamellar structure, was obtained. Tensile test s were performed within the temperature interval from -196 to 350 degrees C . The yield stress sigma(0.2)(T) has a maximum near T-p congruent to 300 de grees C. The sigma(0.2) value at T-p is nearly twice as high as the value a t room temperature. A sharp drop of ductility from 18% at room temperature to 3% at 250 degrees C is found. The TEM analysis revealed the presence of single dislocations, superdislocations and microtwins. Long rectilinear dis locations are observed at 250 degrees C. They have been identified as block ed screw superdislocations with a Burgers vector type < 101]. Numerous curv ed single dislocations are seen, but blocked single dislocations were not d etected in CuAu, unlike in TiAl. The temperature dependence of the yield st ress sigma(0.2) for the fine-grained (0.5 mu m) CuAu alloy was studied too. A temperature peak of sigma(0.2)(T) is still observed. The various models have been discussed to account for the specific deformation behavior of CuA u. (C) 1999 Elsevier Science Ltd. All rights reserved.