Co/Cu solid solution prepared by ion implantation

Citation
J. Noetzel et al., Co/Cu solid solution prepared by ion implantation, J MAGN MAGN, 205(2-3), 1999, pp. 177-183
Citations number
14
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS
ISSN journal
03048853 → ACNP
Volume
205
Issue
2-3
Year of publication
1999
Pages
177 - 183
Database
ISI
SICI code
0304-8853(199911)205:2-3<177:CSSPBI>2.0.ZU;2-U
Abstract
A Co/Cu solid solution is prepared by direct implantation of 200 keV Co+ io ns into Cu targets. The maximum concentration at this ion energy is limited to 25 at% Co due to sputtering. Magnetic measurements show a spin-glass be haviour, as expected for a solid solution of Co in Cu. At about 630 K the s olid solution starts to decompose into clusters. After heat treatment, ferr o- and superparamagnetic behaviour is observed, indicating that the size of the clusters is broadly distributed. (C) 1999 Elsevier Science B.V. All ri ghts reserved.