Thermal expansion behavior and microstructure in bulk nanocrystalline selenium by thermomechanical analysis

Citation
Hy. Zhang et Bs. Mitchell, Thermal expansion behavior and microstructure in bulk nanocrystalline selenium by thermomechanical analysis, MAT SCI E A, 270(2), 1999, pp. 237-243
Citations number
22
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
ISSN journal
09215093 → ACNP
Volume
270
Issue
2
Year of publication
1999
Pages
237 - 243
Database
ISI
SICI code
0921-5093(19990930)270:2<237:TEBAMI>2.0.ZU;2-R
Abstract
Thermal expansion behavior of bulk nanocrystalline (NC) Se samples with a g rain size range of 16-46 nm was studied by thermomechanical analysis (TMA) in the temperature range 290-373 K. Bulk NC Se samples were prepared by iso thermally crystallizing the as-quenched bulk amorphous solid at 373-478 K. The glass transition and crystallization of the remaining amorphous Se in t he partially crystallized samples were studied by TMA, and compared with th e results of differential scanning calorimetry (DSC). The glass transition temperature, as determined from the thermal expansion behavior, was 308 K, 11 K lower than the value by DSC analysis. A structural densification pheno menon was observed in a grain growth process of an as-crystallized NC Se sa mple by TMA. It was found that the linear thermal expansion coefficient of the bulk NC Se sample increased with a reduction of grain size, from which the deduced thermal expansion coefficient of the interface decreased with t he refinement of the grain size. (C) 1999 Elsevier Science S.A. All rights reserved.