Effect of texture and testing conditions on strain localization during cyclic deformation of copper polycrystals

Fatigue tests were performed on pure copper polycrystals with a crystallogr aphic texture different from that produced by 'standard' thermomechanical t reatments, which emphasize multi-slip < 111 >-< 100 > textures. The texture along the loading axis deviated by 10-15 degrees from these two poles for the samples used here. The experiments were initiated by ramp loading as a mechanical pretreatment and the cyclic stress-strain curve (CSSC) was estab lished by step tests using enough cycles at each step to insure saturation. Under these conditions, a plateau was observed in the CSSC at an appropria te stress level and in a reproducible fashion. (C) 1999 Elsevier Science S. A. All rights reserved.