Development of poly-Si TFT in NEC

Authors
Citation
F. Okumura, Development of poly-Si TFT in NEC, NEC RES DEV, 40(4), 1999, pp. 424-428
Citations number
18
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
NEC RESEARCH & DEVELOPMENT
ISSN journal
0547051X → ACNP
Volume
40
Issue
4
Year of publication
1999
Pages
424 - 428
Database
ISI
SICI code
0547-051X(199910)40:4<424:DOPTIN>2.0.ZU;2-C
Abstract
This paper is an introduction to a group of five papers on poly-Si Thin Fil m Transistor (TFT) research and development within NEC. Poly-Si TFT is a co re technology for next generation LCDs (Liquid Crystal Displays), sensors a nd other application devices. Especially, low temperature poly-Si TFTs are very promising because of their wide application range. NEC Corporation has been conducting research of low temperature poly-Si process such as excime r laser process technology including annealing and doping, process temperat ure lowering by RPCVD (Remote Plasma-Enhanced Chemical Vapor Deposition), a nd development of many kinds of input/outoput devices, especially light val ves and novel pen-shaped scanner. Future research would create a new market by developing plastic substrate compatible process and single crystalline silicon on a glass substrate.