DIRECT METALLIZATION OF TEFLON-BASED PRINTED-CIRCUIT BOARDS

Using Taguchi's L-16 orthogonal array and Yate's method, the optimal c onditions for the direct metallization of copper on Teflon-based print ed circuit boards are determined. The performances of direct copper me tallization techniques are evaluated using the peel strength and the t otal energy consumption used in the plating process. The peel strength of the copper film was found to be approximately 310.7 g cm(-1), whic h is comparable to existing products developed using a commercial auto catalytic electrodeless copper plating method.