INFLUENCE OF MAGNETIC-FIELD CONFIGURATION ON THE DEPOSITION CONDITIONS IN AN UNBALANCED MAGNETRON SYSTEM

Three configurations of a magnetron sputter ion plating system were co nsidered: the double magnetron open field configuration, single magnet ron multipole open field configuration and single magnetron multipole closed held configuration. The (TI,AI)N coating was deposited in the d ouble magnetron system onto substrates oscillating in and out of high ionization degree plasma obtained by overlapping two magnetron dischar ges. A strong influence of plasma ''density'' on the coating growth wa s found. The experiments were also performed in two single magnetron s ystems in order to find approximately the region in which a plasma sui table for coating deposition is generated. A rough estimation of high density plasma pattern was given based on voltage-current characterist ics of the magnetron discharge. Both single magnetron systems were fou nd suitable for hard coating deposition, but the higher bias current d ensity at the substrate surface had been measured in closed field conf iguration under similar deposition conditions.