Citation
Ga. Riley et D. Moore, Gearing up for flip chip, SOL ST TECH, 42(10), 1999, pp. 87
Citations number
5
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
SOLID STATE TECHNOLOGY
ISSN journal
0038111X
→ ACNP
Volume
42
Issue
10
Year of publication
1999
Database
ISI
SICI code
0038-111X(199910)42:10<87:GUFFC>2.0.ZU;2-8
Abstract
Here is a proven method for bumping singulated die using wire bonding. It e
nables cost-effective evaluation and entry into flip-chip applications.