This paper is an overview of the work carried out in the finishing of Si3N4
balls for bearing applications using a novel process known as the magnetic
float polishing (MFP). It is a "gentle" process in which very low levels o
f controlled force (similar to 0.5-2 N) is applied. The process can be divi
ded into the following three stages: (1) an initial high material removal s
tage where the objective is to remove material as rapidly as possible with
minimal damage to the surface, (2) an intermediate stage of semifinishing w
here size and sphericity are carefully monitored, and (3) final finishing s
tage where size, sphericity, and finish are closely controlled to meet the
final requirements. The first process predominantly involves mechanical rem
oval of material with harder and coarser abrasives, e.g., coarse B4C; the s
econd process involves the use of "less" harder and finer abrasives, e.g.,
medium to fine B4C or SiC; and the third process involves the use of "much"
softer abrasives, e.g., CeO2, ZrO2, and Cr2O3 that can chemo-mechanically
react with the workmaterial (Si3N4) and/or the environment (air or water) t
o generate a smooth surface. Chemo-mechanical polishing of Si3N4 balls with
CeO2 abrasive yields an extremely smooth and damage-free surface with a su
rface finish R-a of 4 nm and an R-t of 40 nm and a sphericity of 0.15-0.25
mu m.