A grinding map concept for optimization of ceramic machining

This paper describes a systematic attempt to isolate various parameters tha t affect the material removal al rate for diamond grinding of silicon nitri de ceramics. The influence of different coolants and operating parameters s uch as force, depth of cut, and diamond grit size on the material I removal rates under controlled conditions of single pass grinding is determined. S everal parameters were developed to aid in interpretation of the grinding r esults. The parameters include grinding force coefficient, retained grindin g efficiency and instantaneous grinding rate. A grinding map concept was de veloped to allow rapid visual evaluation of grinding performance for a give n coolant and a set of operating conditions. The results suggest that material removal rates in grinding of silicon nitr ide ceramics can be increased through optimization of machining parameters and the proper use of suitable coolants. The major contribution to decrease d grinding rates for silicon nitride machining in these tests was due to du lling of the diamond abrasive embedded in the grinding wheel. Significant c oolant chemistry effects were observed as it affects the diamond dulling ra te due to oxidative wear mechanisms.