P. Hartig et al., Kinetic and topographic investigation of copper deposition/stripping in anacid copper environment, ELECTROCH C, 1(9), 1999, pp. 398-401
The existence of upd copper on roughened polycrystalline Pt contacted to an
acid copper environment has been demonstrated by means of the in situ quar
tz crystal microbalance (QCMB) technique. The information was taken from cu
rrent and mass transients monitored simultaneously with millisecond resolut
ion. The electrosorption valency was observed to be close to unity in this
environment. The deposition/ stripping kinetics evaluated from mass transie
nts clearly demonstrate that the formation of upd copper occurs prior to bu
lk formation. On the other hand, stripping of the bulk phase occurs before
the dismantling of the upd film. (C) 1999 Elsevier Science S.A. All rights
reserved.