Although integrated microinductors are in high demand for high frequency ap
plications, their usefulness is limited due to their poor performance (e.g.
, low Q-factor, low inductance, and high parasitics). To expand the range o
f applicability of integrated microinductors at high frequencies, their ele
ctrical characteristics, especially quality factor and inductance, must be
improved. In this research, integrated spiral-type microinductors suspended
above the silicon substrate using surface micromachining and electroplatin
g techniques are investigated. The silicon substrate used has resistivity r
anging from 3 similar to 7 ohms-cm and thickness ranging from 330 mu m simi
lar to 430 mu m. These fabricated inductors have inductance ranging from 10
similar to 25 nH and Quality factor ranging from 14 similar to 18.