The mechanics of electronic materials

Authors
Citation
Lb. Freund, The mechanics of electronic materials, INT J SOL S, 37(1-2), 2000, pp. 185-196
Citations number
41
Categorie Soggetti
Mechanical Engineering
Journal title
INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES
ISSN journal
00207683 → ACNP
Volume
37
Issue
1-2
Year of publication
2000
Pages
185 - 196
Database
ISI
SICI code
0020-7683(200001)37:1-2<185:TMOEM>2.0.ZU;2-K
Abstract
The primacy engineering function of electronic materials is the control of electric charge for some useful purpose, rather than any mechanical load ca rrying function. However, mechanical stress and its consequences are centra l factors in the fabrication, performance and reliability of microelectroni c devices, broadly affecting one of the largest industries in the world. He re, attention is focused on the role of stress in the fabrication of semico nductor heterostructures. Particular attention is devoted to strain relaxat ion by dislocation formation and interaction, stress-driven surface morphol ogy evolution, and the influence of strain on electronic transport characte ristics in quantum structures relevant to the next generation of devices. ( C) 1999 Elsevier Science Ltd. All rights reserved.