The adherence energy measured during the separation of adhesive/substrate a
ssemblies is a complex function of the adhesion energy and also of the diss
ipative properties of both adhesive and substrate. Dissipative phenomena oc
curring during an assembly separation are reflected in the dependence of th
e measured energy on separation rate. Up to now, different relationships ha
ve been used to describe the dependence of the adherence energy G on separa
tion speed V. However, these models assume that only the separation speed a
ffects the dissipation function; the adhesion energy W is supposed to remai
n constant. This paper proposes that the "real" adhesion energy is also rat
e dependent, Indeed, the number of interfacial interaction points under str
ess is able to increase with speed. This effect could be a consequence of t
he influence of separation rate on the adhesive elastic modulus, (C) 1999 A
cademic Press.