Inactivation kinetics of Saccharomyces cerevisiae during thermal treatments
at moderate temperatures (45.0, 47.5, 50.0, 52.5, or 55.0 degrees C) combi
ned with application of 20 kHz of ultrasound were evaluated. S. cerevisiae
inactivation under the combined effects of heat and ultrasound followed fir
st-order reaction kinetics, with decimal reduction times (D) that varied fr
om 22.3 to 0.8 min. D values in treatments that combined heat and ultrasoun
d were significantly smaller (P < 0.05) than D values obtained for thermal
treatments and were more noticeable at temperatures below 50 degrees C. The
dependence of the D value on temperature had a significantly (P < 0.05) gr
eater z value for combined treatments. Yeast heat inactivation kinetics rev
ealed decreased thermal resistance caused by ultrasound.