Anomalous wetting of Ti-48 at.% Al-2 at.% Cr-2 at.% Nb substrates by liquid copper

Conventionally, the wetting of metallic substrates by liquid metals involve s undermining of the substrate-oxide layer by the liquid. Evidence is prese nted here for an alternative wetting process involving spreading of Liquid copper along the exterior of the oxide layer on Ti-48 at.% A1-2 at.% Cr-2 a t.% Nb substrates. A mechanism is presented that involves compositional cha nges in the liquid, which in rum allow a wetting-promoting reaction between the (initially unreactive) liquid and the exterior layer of the substrate oxide.