Conventionally, the wetting of metallic substrates by liquid metals involve
s undermining of the substrate-oxide layer by the liquid. Evidence is prese
nted here for an alternative wetting process involving spreading of Liquid
copper along the exterior of the oxide layer on Ti-48 at.% A1-2 at.% Cr-2 a
t.% Nb substrates. A mechanism is presented that involves compositional cha
nges in the liquid, which in rum allow a wetting-promoting reaction between
the (initially unreactive) liquid and the exterior layer of the substrate
oxide.