Real time monitoring and control of wet etching of GaAs/Al0.3Ga0.7As usingreal time spectroscopic ellipsometry

Citation
Sj. Cho et Pg. Snyder, Real time monitoring and control of wet etching of GaAs/Al0.3Ga0.7As usingreal time spectroscopic ellipsometry, J VAC SCI B, 17(5), 1999, pp. 2045-2049
Citations number
12
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
ISSN journal
10711023 → ACNP
Volume
17
Issue
5
Year of publication
1999
Pages
2045 - 2049
Database
ISI
SICI code
1071-1023(199909/10)17:5<2045:RTMACO>2.0.ZU;2-7
Abstract
Real time spectroscopic ellipsometry (RTSE) was used to monitor etching of GaAs/Al0.3Ga0.7As/GaAs heterostructures in citric acid:hydrogen peroxide:de -ionized water (25:1:75). Etch rates of GaAs and AlGaAs of 15.3 and 17.6 nm /min, respectively, were determined by numerically fitting the RTSE data. A variable delay in the onset of etching was observed, and was related to va riations in surface cleanliness and the initial oxide thickness. Real time monitoring was also used to control stopping of the nonselective etch after removal of the GaAs cap layer. In addition, etch depth control in the AlGa As layer was demonstrated. Etching was stopped with 100 nm of AlGaAs remain ing. Finally, RTSE was used to monitor wet etching of a patterned sample (7 5% of the surface area was covered by photoresist). (C) 1999 American Vacuu m Society. [S0734-211X(99)01405-5].