Si(100)-(2x1) etching with fluorine: Planar removal versus three dimensional fitting

Citation
Ks. Nakayama et Jh. Weaver, Si(100)-(2x1) etching with fluorine: Planar removal versus three dimensional fitting, PHYS REV L, 83(16), 1999, pp. 3210-3213
Citations number
25
Categorie Soggetti
Physics
Journal title
PHYSICAL REVIEW LETTERS
ISSN journal
00319007 → ACNP
Volume
83
Issue
16
Year of publication
1999
Pages
3210 - 3213
Database
ISI
SICI code
0031-9007(19991018)83:16<3210:SEWFPR>2.0.ZU;2-R
Abstract
The morphologies achieved by thermally activated reactions of adsorbed F wi th Si(100)-(2 X 1) were studied with scanning tunneling microscopy. Dimer v acancies were produced in the top layer but, more significantly, there was a new reaction pathway that gave rise to multilayer pitting even when the s urface concentration was very low. This pathway can be linked to the atomic structure of the exposed layer and the formation of SiF2 in that layer. It accounts for surface roughening, and it is very effective.