J. Schollhammer et al., Measurement of the profile and the dihedral angle of grain boundary grooves by atomic force microscopy, Z METALLKUN, 90(9), 1999, pp. 687-690
Grain boundary grooves of pure Cu and Cu-50 at.ppm Bi bicrystals were measu
red by means of atomic force microscopy. An unprecedented accuracy was atta
ined with this method. An analytical function proposed by Mullins for the g
rooving process was fitted to the measured groove profile. Extrapolation of
this fitted function in the groove root of the profile led to accurate val
ues of the dihedral angle.