Some thermal properties of a copper-tin alloy

Citation
Bj. Monaghan et al., Some thermal properties of a copper-tin alloy, INT J THERM, 20(4), 1999, pp. 1051-1060
Citations number
14
Categorie Soggetti
Physical Chemistry/Chemical Physics
Journal title
INTERNATIONAL JOURNAL OF THERMOPHYSICS
ISSN journal
0195928X → ACNP
Volume
20
Issue
4
Year of publication
1999
Pages
1051 - 1060
Database
ISI
SICI code
0195-928X(199907)20:4<1051:STPOAC>2.0.ZU;2-6
Abstract
The thermal properties (heat capacity, thermal diffusivity, and electrical resistivity) of a Cu + 10 wt % Sn alloy in both solid and liquid phases hav e been reported. Using these values it was confirmed that the Lorenz relati on is suitable for obtaining thermal conductivity from electrical resistivi ty in the liquid phase of this alloy. Also, the temperature differential (d lambda/dT) obtained from such an approach was in excellent agreement with the thermal conductivity values calculated from thermal diffusivity.