EFFECT OF DEPOSITION CONDITIONS FOR GAMMA-AMINOPROPYLTRIETHOXY SILANEON ADHESION BETWEEN COPPER AND EPOXY-RESINS

Authors
GU XH XUE G JIANG BC
Citation
Xh. Gu et al., EFFECT OF DEPOSITION CONDITIONS FOR GAMMA-AMINOPROPYLTRIETHOXY SILANEON ADHESION BETWEEN COPPER AND EPOXY-RESINS, Applied surface science, 115(1), 1997, pp. 66-73
Citations number
21
Categorie Soggetti
Physics, Condensed Matter","Chemistry Physical","Materials Science, Coatings & Films
Journal title
Applied surface science → ACNP
ISSN journal
01694332
Volume
115
Issue
1
Year of publication
1997
Pages
66 - 73
Database
ISI
SICI code
0169-4332(1997)115:1<66:EODCFG>2.0.ZU;2-U
Abstract
By investigating the pretreatment conditions of copper places with gam ma-aminopropyltriethoxy silane (gamma-APS) alcoholic solution, we have demonstrated that the deposition conditions have a significant effect on the adhesion and thr durability of copper/epoxy joints. The thickn ess and the structure of the primer, the existence of metal ions in th e interphase and the interaction and the interdiffusion of the primer with the epoxy resins contribute together to the effect.