Pt/Ti thin film adhesion on SiNx/Si substrates

The adhesion of Pt/Ti thin films on SiNx/Si substrates with respect to the substrate pretreatment and annealing ambient was investigated using the adh esive tape test, the peel test, and the scratch test. Pt/Ti thin films were deposited a DC magnetron sputtering system. The in situ Ar+ RF plasma trea tment was more effective in enhancing adhesion between the Pt/Ti thin films and the SiNx/Si substrate than chemical cleaning. After annealing in an ox ygen ambient, the adhesion of the Pt/Ti/SiNx/Si specimen was degraded. This adhesion degradation was attributed to the depletion of the Ti adhesion la yer due to the formation of the rutile TiO2 phase.