In this paper, we report ultra thin high quality nitride/oxide gate dielect
rics prepared by rapid thermal NH3 nitridation of Si followed by in-situ N2
O oxidation (NH3+N2O process). These films show excellent interface propert
ies, significant lower leakage current (similar to 10(2)X), enhanced reliab
ility, and superior boron diffusion barrier properties compared with Sig of
identical equivalent oxide thickness (Tox,eq).