An experimental method capable of separating electron and hole transient cu
rrents in MOS devices is presented. The measurements of transient discharge
resulting from voltage step above threshold voltage allow a quantitative e
valuation of the trap energy distribution and of its dependence on stress.
Traps aligned with the oxide band gap are found to increase strongly after
stress. The separation of steady-state currents has been also performed, an
d discussed in terms of the stress-dependent trap distribution obtained fro
m the transient separation analysis.