In situ Rutherford backscattering spectrometry analysis of films by combination with sputter etching

Citation
L. Jiang et al., In situ Rutherford backscattering spectrometry analysis of films by combination with sputter etching, CHIN PHYS L, 16(10), 1999, pp. 770-772
Citations number
8
Categorie Soggetti
Physics
Journal title
CHINESE PHYSICS LETTERS
ISSN journal
0256307X → ACNP
Volume
16
Issue
10
Year of publication
1999
Pages
770 - 772
Database
ISI
SICI code
0256-307X(1999)16:10<770:ISRBSA>2.0.ZU;2-M
Abstract
We have set up an experimental system consisting of an ion gun and a Ruther ford backscattering spectrometry(RBS) analysis chamber. Using this system, in situ 2Mev He-4(+) RBS analysis of films is carried out by combination wi th sputter etching of low energy Ar+ ions. As an example of the sputtering/ RBS method, the analysis of three samples, i.e., Si/(GexSi1-x/Si)/Si(100), WSix/SiO2/Si and CoSix/Si, is presented in this paper. After an appropriate fraction of the thick layer is removed by sputtering, the back edge of the Ge peak is separated from Si RBS spectrum an the interface and the O peak of the buried SiO2 layer can be identified. The change of the doped Ti and W concentrations related to Co on the top surface is observed. The advantag es of this analytical method and its possible applications in film are disc ussed.