In a drying process of dielectric resin films coated on electric conductive
substances, phenomena such as polymerization of monomers, by-products yiel
d, shrinkage and stress generation; take place simultaneously in addition t
o heat and mass transfer. For the enhancement of the drying with high effic
iency and high quality, it is important to understand the drying mechanism.
In this paper, the characteristics of heat and mass transfer in the resin
film including polycondensation reaction are presented. The apparent drying
rate of polyamideimide varnish films was measured in two different heating
modes of radiation and convection. The reaction rate of polycondensation w
as analyzed both by the thermogravimetry and the differential scanning calo
rimetry. The apparent drying rate began to drop remarkably when the reactio
n rate became significant. It implies that the diffusion of the solvent is
inhibited by skinning at the surface. Applying the Vrentas/Duda free-volume
diffusion model to the prediction of diffusivity, the heat and mass transf
er in the resin film were analyzed theoretically with a reasonable accuracy
.