A study of lubricants on silver flakes for microelectronics conductive adhesives

Citation
Dq. Lu et al., A study of lubricants on silver flakes for microelectronics conductive adhesives, IEEE T COMP, 22(3), 1999, pp. 365-371
Citations number
13
Categorie Soggetti
Material Science & Engineering
Journal title
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
ISSN journal
15213331 → ACNP
Volume
22
Issue
3
Year of publication
1999
Pages
365 - 371
Database
ISI
SICI code
1521-3331(199909)22:3<365:ASOLOS>2.0.ZU;2-C
Abstract
Conductive adhesives are composites of polymer matrixes and metal fillers ( conductive elements). Silver (Ag) flakes are widely used as fillers for ele ctrically conductive adhesives (ECA's), Generally, there is a thin layer of organic lubricant coated on the commercial Ag flake surface. This lubrican t layer is needed for eliminating the Ag particle agglomeration while dispe rsing the Ag filler into the polymeric resin. Therefore the lubricant influ ences rheology, conductivity, and other properties of ECA's. The nature of the lubricant on a Ag flake and the interaction between the lubricant and t he Ag flake surface were studied by diffuse reflectance infrared spectrosco py (DRIR), Thermal decomposition of the lubricant was studied by differenti al scanning calorimetry (DSC) and thermogravimetric analysis (TGA), In addi tion, the effects of some chemical compounds on lubricant removal and the e nhancement of conductivity of the ECA were also investigated. It was found that 1) a chemical bonding was formed on the Ag flake surface between the lubric ant and Ag; 2) the short chain acids replaced the long chain lubricants; 3) an ether and a poly(ethylene glycol) enhanced electrical conductivity by partially removing the Ag flake lubricants.