Integrated single and two-phase micro heat sinks under IGBT chips

Citation
C. Gillot et al., Integrated single and two-phase micro heat sinks under IGBT chips, IEEE T COMP, 22(3), 1999, pp. 384-389
Citations number
14
Categorie Soggetti
Material Science & Engineering
Journal title
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
ISSN journal
15213331 → ACNP
Volume
22
Issue
3
Year of publication
1999
Pages
384 - 389
Database
ISI
SICI code
1521-3331(199909)22:3<384:ISATMH>2.0.ZU;2-O
Abstract
Experiments have been performed to assess the feasibility of single and two -phase micro heat exchangers applied to the cooling of insulated gate bipol ar transistor (IGBT) power components. After a brief recall of the principa l characteristics of such heat exchangers, prototypes that have been built and tested are described. Then, the experimental measurements are compared to the predictions of the thermal and hydraulic performance with water and the inert fluorocarbon liquid (FC72) as coolant fluids.