Analysis of thermal warpage in a PCB with an array of PTH connectors

Finite element analysis (FEA) was used to model the thermally-induced warpa ge of a printed-circuit-board (PCB) assembly having an array of pin-through -hole (PTH) connectors during a dual-wave soldering process. The estimates of board warpage were compared with experimental measurements, and it was c oncluded that the model is capable of representing assembly deformation dur ing and after wave soldering. Subsequent parametric studies of the effects of different PCB and connector material properties have resulted in general guidelines for the selection of these properties.