Br. Bickmore et al., Methods for performing atomic force microscopy imaging of clay minerals inaqueous solutions, CLAY CLAY M, 47(5), 1999, pp. 573-581
Three methods were developed that allow for the imaging of any clay mineral
in aqueous solutions with atomic force microscopy (AFM). The methods invol
ve fixing the particles onto special substrates that do not complicate the
imaging process, but hold the particles sufficiently so that they do not mo
ve laterally or float away during imaging. Two techniques depend on electro
static attraction under circumneutral pH conditions, between the negatively
charged clay particles and the high point of zero charge substrate (either
aluminum oxide or polyethyleneimine-coated mica) whereas the third techniq
ue depends on adhesion to a thermoplastic film. The first electrostatic tec
hnique involves a polished single crystal alpha-Al2O3 (sapphire) substrate.
This was used successfully as a substrate for clay-sized minerals with hig
h permanent layer charge localized on the basal planes (phlogopite and verm
iculite) and when the AFM was operated in TappingMode to limit the lateral
forces between the probe tip and the particles. However, electrostatic attr
action between the sapphire surface and clay minerals such as smectite and
kaolinite (low or no permanent layer charge) is not sufficiently strong to
adequately fix the particles for imaging. The second electrostatic techniqu
e involves a polyethyleneimine-coated mica surface designed to immobilize a
larger variety of clay minerals (phlogopite, vermiculite, montmorillonite,
and kaolinite), and in this technique weak bonding between the clay and th
e organic film is also a factor. The third technique, which does not depend
on electrostatic attraction, fixes clay particles into the surface of a th
ermoplastic adhesive called Tempfix. This has proven useful for fixing and
imaging relatively large clay particles with well-defined morphology. The T
empfix mount also requires imaging in TappingMode be cause the Tempfix is r
elatively soft.