The fabrication and characterization of in situ-doped amorphous Si0.8C0.2 e
mitter transistors are presented. Emitter Gummel numbers exceeding 10(14) s
/cm(4) are reported for the first time in this type of structure. The high
values obtained for GE are believed to be due to the valance band discontin
uity between the Si0.8C0.2 layer and the crystalline part of the emitter, w
hich effectively blocks the minority carrier injection from the base into t
he noncrystalline part of the emitter.