Thermal characterization of diamond-pressure-bond heat sinking for optically pumped mid-infrared lasers

Authors
Bewley, WW Felix, CL Aifer, EH Stokes, DW Vurgaftman, I Olafsen, LJ Meyer, JR Yang, MJ Lee, H
Citation
Ww. Bewley et al., Thermal characterization of diamond-pressure-bond heat sinking for optically pumped mid-infrared lasers, IEEE J Q EL, 35(11), 1999, pp. 1597-1601
Citations number
14
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Eletrical & Eletronics Engineeing
Journal title
IEEE JOURNAL OF QUANTUM ELECTRONICS
ISSN journal
00189197 → ACNP
Volume
35
Issue
11
Year of publication
1999
Pages
1597 - 1601
Database
ISI
SICI code
0018-9197(199911)35:11<1597:TCODHS>2.0.ZU;2-Q
Abstract
The heat sinking properties of optically pumped semiconductor lasers mounte d by the diamond-pressure-bonding (DPB) technique have been evaluated quant itatively. This method combines epi-side-down mounting with minimal process ing and top optical access via pumping through the diamond. By correlating the pump-intensity variation of the emission wavelength with its temperatur e variation, specific thermal resistances have been determined for DPB-moun ted type-II "W" lasers operating in the mid-infrared. Values less than or e qual to 2.0 K.cm(2)/kW were obtained for all temperatures in the range 140- 220 K.