A 0.2-mu m, 1.8-V, SOI, 550-MHz, 64-b PowerPC microprocessor with copper interconnects

Authors
Aipperspach, AG Allen, DH Cox, DT Phan, NV Storino, SN
Citation
Ag. Aipperspach et al., A 0.2-mu m, 1.8-V, SOI, 550-MHz, 64-b PowerPC microprocessor with copper interconnects, IEEE J SOLI, 34(11), 1999, pp. 1430-1435
Citations number
4
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
IEEE JOURNAL OF SOLID-STATE CIRCUITS
ISSN journal
00189200 → ACNP
Volume
34
Issue
11
Year of publication
1999
Pages
1430 - 1435
Database
ISI
SICI code
0018-9200(199911)34:11<1430:A0M1S5>2.0.ZU;2-F
Abstract
A 550-MHz 64-b PowerPC processor in 0.2-um silicon on-insulator (SOI) coppe r technology achieves a 22% frequency gain over a similar design in a CMOS hulk technology, Performance gains are 15%-40% at the circuit level, 24%-28 % for critical paths. Unique SOI design aspects such as history effect, low ered noise margins, parasitic bipolar current, and self-heating are conside red.